Rolf Evenblij

Temperature control at chip level

16:00 – 16:30

With today’s capability for complex optical designs on integrated photonics, packaging and actual thermal control has become increasingly important in order to achieve required thermal stability for demanding applications. Thermal control through cooling or heating appears a preferred approach in order to achieve that. However, for more stringent environments where thermal spans range from -55 to +85C or even higher, something more is needed. In this presentation Technobis will demonstrate that by efficient thermal control and well-designed optical chips and packaging systems a greater thermal stability can be achieved for a larger compliant scope.

Rolf Evenblij

Technobis