From nano-world specifications to real lithography optics
15:30 – 16:00
Modern high-end chip manufacturing requires ultra-precision machines. The essential process of chip structuring is optical lithography which is performed by so-called wafer scanners. These wafer scanners have to meet extreme requirements.
This lecture sketches the long way from top level specifications of a wafer scanner to the realization of a volume manufactured lithography projection optics box.
Complex systems need to be divided into manageable modules and components. To ensure the function of the complete system, system engineering, concurrent engineering as well as periodic system validation play an important role. Furthermore, design for manufacturing and assembly is one of the key successors for commercial products.
1984-1990: Studies of mechanical engineering, University of Stuttgart
1990-2001: Development and test engineer, ZF-Friedrichshafen
2001-2004: Mechanical design – DUV lens modules, Zeiss SMT
2004-2011: Module owner – active DUV lens modules, Zeiss SMT
2011-2016: System engineering – EUV illumination systems, Zeiss SMT
2016-now: Module architect – measurement system for high-NA mirrors, Zeiss SMT.